A US manufacturer supplying interconnect components to the semiconductor industry required an automated, contact force measurement system capable of measuring compression forces of very small devices on a 300mm substrate.
Scaling their products for the larger wafer size, the customer required an easily configurable system for testing thousands of measurements over a multitude of part types at a rate of up to 3,000 tests per hour, providing accurate force and height data.
To measure the device accurately, the system was required to measure forces between 0-30 grams over a 50µm compressed distance. The device height values had to be determined to within ±2.5µm over the entire 300mm envelope. To meet these requirements, the team designed a standard platform for testing the device. Features of the platform include:
outcomes and benefits
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